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HF115AC-0.0055-AC-54

THERM PAD 19.05MMX12.7MM W/ADH


  • Manufacturer: Bergquist
  • Nocochips NO: 108-HF115AC-0.0055-AC-54
  • Package: -
  • Datasheet: PDF
  • Stock: 377
  • Description: THERM PAD 19.05MMX12.7MM W/ADH (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Material Phase Change Compound
Shape Rectangular
Series Hi-Flow® 115-AC
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Pad, Sheet
Color Gray
Usage TO-220
Shelf Life 6 Months
Adhesive Adhesive - One Side
Backing, Carrier Fiberglass
Outline 19.05mm x 12.70mm
Thermal Conductivity 0.8W/m-K
Natural Thermal Resistance 0.35 °C/W
Thickness 0.0055 0.140mm
RoHS Status ROHS3 Compliant
See Relate Datesheet

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