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HF115AC-0.0055-AC-90

THERM PAD 21.84MMX18.79MM W/ADH


  • Manufacturer: Bergquist
  • Nocochips NO: 108-HF115AC-0.0055-AC-90
  • Package: TO-218
  • Datasheet: PDF
  • Stock: 322
  • Description: THERM PAD 21.84MMX18.79MM W/ADH (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Package / Case TO-218
Material Phase Change Compound
Shape Rectangular
Series Hi-Flow® 115-AC
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Pad, Sheet
Color Gray
Usage TO-218, TO-220, TO-247
Shelf Life 6 Months
Adhesive Adhesive - One Side
Backing, Carrier Fiberglass
Outline 21.84mm x 18.79mm
Thermal Conductivity 0.8W/m-K
Natural Thermal Resistance 0.35 °C/W
Thickness 0.0055 0.140mm
RoHS Status ROHS3 Compliant
See Relate Datesheet

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