HFA60MC60C
| Parameters | |
|---|---|
| Mount | Chassis Mount |
| Mounting Type | Chassis Mount |
| Package / Case | TO-249AA |
| Diode Element Material | SILICON |
| Packaging | Bulk |
| Published | 1999 |
| Series | HEXFRED® |
| Pbfree Code | no |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 3 |
| HTS Code | 8541.10.00.80 |
| Terminal Position | SINGLE |
| Terminal Form | SOLDER LUG |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Reach Compliance Code | unknown |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-PSFM-D3 |
| Qualification Status | Not Qualified |
| Operating Temperature (Max) | 150°C |
| Operating Temperature (Min) | -55°C |
| Number of Elements | 2 |
| Element Configuration | Common Cathode |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) |
| Diode Type | Standard |
| Current - Reverse Leakage @ Vr | 10μA @ 600V |
| Voltage - Forward (Vf) (Max) @ If | 1.5V @ 30A |
| Case Connection | ISOLATED |
| Output Current-Max | 60A |
| Application | GENERAL PURPOSE |
| Current - Average Rectified (Io) | 50A DC |
| Max Reverse Voltage (DC) | 600V |
| Average Rectified Current | 50A |
| Number of Phases | 1 |
| Reverse Recovery Time | 100 ns |
| Diode Configuration | 1 Pair Common Cathode |
| RoHS Status | ROHS3 Compliant |
See Relate Datesheet
