HMC554LC3B
| Parameters | |
|---|---|
| Width | 3mm |
| REACH SVHC | Unknown |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Contains Lead |
| Lifecycle Status | LAST TIME BUY (Last Updated: 5 days ago) |
| Contact Plating | Gold |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 12-VFCQFN Exposed Pad |
| Number of Pins | 12 |
| Packaging | Strip |
| JESD-609 Code | e4 |
| Pbfree Code | no |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 12 |
| ECCN Code | EAR99 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| HTS Code | 8542.39.00.01 |
| Max Power Dissipation | 150mW |
| Terminal Position | QUAD |
| Terminal Form | NO LEAD |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Number of Functions | 1 |
| Terminal Pitch | 0.5mm |
| Frequency | 20GHz |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Pin Count | 12 |
| Qualification Status | Not Qualified |
| Temperature Grade | INDUSTRIAL |
| Telecom IC Type | TELECOM CIRCUIT |
| Height Seated (Max) | 0.92mm |
| Length | 3mm |
See Relate Datesheet
