HMC555
| Parameters | |
|---|---|
| Lifecycle Status | LAST TIME BUY (Last Updated: 1 week ago) |
| Mounting Type | Surface Mount |
| Package / Case | Die |
| Surface Mount | YES |
| Packaging | Bulk |
| JESD-609 Code | e4 |
| Pbfree Code | no |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 6 |
| ECCN Code | EAR99 |
| Terminal Finish | Gold (Au) |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -55°C |
| Max Power Dissipation | 582mW |
| Terminal Position | UPPER |
| Terminal Form | NO LEAD |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Number of Functions | 1 |
| Frequency | 31GHz~38GHz |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-XUUC-N6 |
| Qualification Status | Not Qualified |
| Temperature Grade | OTHER |
| Telecom IC Type | TELECOM CIRCUIT |
| RF Type | General Purpose |
| Secondary Attributes | Up Converter |
| Number of Mixers | 2 |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Contains Lead |
See Relate Datesheet
