HMC560LM3
| Parameters | |
|---|---|
| Lifecycle Status | OBSOLETE (Last Updated: 5 days ago) |
| Mounting Type | Surface Mount |
| Package / Case | 6-TQFN Exposed Pad |
| Surface Mount | YES |
| Number of Pins | 6 |
| Packaging | Strip |
| JESD-609 Code | e4 |
| Pbfree Code | no |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 6 |
| ECCN Code | EAR99 |
| Terminal Finish | GOLD OVER NICKEL |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -55°C |
| Max Power Dissipation | 344mW |
| Terminal Position | QUAD |
| Terminal Form | NO LEAD |
| Peak Reflow Temperature (Cel) | 250 |
| Number of Functions | 1 |
| Frequency | 24GHz~40GHz |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Base Part Number | HMC560 |
| Pin Count | 6 |
| Qualification Status | Not Qualified |
| Temperature Grade | OTHER |
| Telecom IC Type | TELECOM CIRCUIT |
| RF Type | General Purpose |
| Noise Figure | 11dB |
| Number of Mixers | 1 |
| Length | 5.08mm |
| Width | 5.08mm |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Contains Lead |
See Relate Datesheet
