Parameters | |
---|---|
Factory Lead Time | 1 Week |
Lifecycle Status | PRODUCTION (Last Updated: 2 weeks ago) |
Contact Plating | Tin |
Mount | Surface Mount |
Package / Case | 24-VFQFN Exposed Pad |
Number of Pins | 24 |
Packaging | Tape & Reel (TR) |
JESD-609 Code | e3 |
Pbfree Code | no |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 24 |
Max Operating Temperature | 85°C |
Min Operating Temperature | -40°C |
Max Power Dissipation | 560mW |
Technology | CMOS |
Terminal Position | QUAD |
Terminal Form | NO LEAD |
Peak Reflow Temperature (Cel) | 260 |
Number of Functions | 1 |
Terminal Pitch | 0.5mm |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Base Part Number | HMC624 |
Pin Count | 24 |
Operating Supply Voltage | 5V |
Temperature Grade | INDUSTRIAL |
Number of Channels | 1 |
Impedance | 50Ohm |
Number of Bits | 6 |
Max Input Voltage | 5.6V |
Bandwidth | 5.9 GHz |
Max Frequency | 6GHz |
Frequency Range | 0Hz~6GHz |
Telecom IC Type | TELECOM CIRCUIT |
Insertion Loss (dB) | 3.8 dB |
Attenuation Value | 31.5dB |
Max Junction Temperature (Tj) | 150°C |
Height | 900μm |
Length | 4mm |
RoHS Status | ROHS3 Compliant |