Parameters | |
---|---|
Factory Lead Time | 1 Week |
Lifecycle Status | PRODUCTION (Last Updated: 1 week ago) |
Package / Case | 16-VFQFN Exposed Pad, CSP |
Surface Mount | YES |
Number of Pins | 16 |
Packaging | Tape & Reel (TR) |
Size / Dimension | 0.118Lx0.118W 3.00mmx3.00mm |
JESD-609 Code | e3 |
Pbfree Code | no |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 16 |
Terminal Finish | Tin (Sn) |
Terminal Position | QUAD |
Terminal Form | NO LEAD |
Peak Reflow Temperature (Cel) | 260 |
Number of Functions | 1 |
Supply Voltage | 5V |
Terminal Pitch | 0.5mm |
Frequency | 100MHz~15GHz |
Time@Peak Reflow Temperature-Max (s) | 30 |
Base Part Number | HMC862 |
Pin Count | 16 |
Operating Temperature (Max) | 85°C |
Operating Temperature (Min) | -40°C |
Temperature Grade | INDUSTRIAL |
Telecom IC Type | TELECOM CIRCUIT |
Height Seated (Max) | 0.9mm |
Length | 3mm |
Width | 3mm |
RoHS Status | ROHS3 Compliant |