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HSE-B635-045H

HEAT SINK, EXTRUSION, TO-220, 63


  • Manufacturer: CUI Devices
  • Nocochips NO: 207-HSE-B635-045H
  • Package: -
  • Datasheet: PDF
  • Stock: 134
  • Description: HEAT SINK, EXTRUSION, TO-220, 63 (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Material Aluminum Alloy
Shape Rectangular, Fins
Package Cooled TO-220
Material Finish Black Anodized
Series HSE
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Type Board Level, Vertical
Attachment Method PC Pin
Height Off Base (Height of Fin) 0.500 12.70mm
Thermal Resistance @ Forced Air Flow 3.53°C/W @ 200 LFM
Thermal Resistance @ Natural 6.41°C/W
Power Dissipation @ Temperature Rise 11.7W @ 75°C
Length 2.500 63.50mm
Width 1.772 45.00mm
RoHS Status RoHS Compliant
See Relate Datesheet

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