HSEC8-110-01-L-DV-A-WT
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Material | Beryllium Copper |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Material - Insulation | Liquid Crystal Polymer (LCP) |
| Operating Temperature | -55°C~125°C |
| Packaging | Tray |
| Published | 2016 |
| Series | Edge Rate™ HSEC8 |
| JESD-609 Code | e3 |
| Feature | Board Guide, Solder Retention |
| Part Status | Active |
| Termination | Solder |
| ECCN Code | EAR99 |
| Connector Type | CARD EDGE CONNECTOR |
| Number of Positions | 20 |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Additional Feature | EDGE RATE CONTACT |
| HTS Code | 8536.69.40.40 |
| Subcategory | Headers and Edge Type Connectors |
| MIL Conformance | NO |
| DIN Conformance | NO |
| IEC Conformance | NO |
| Filter Feature | NO |
| Contact Type | Cantilever |
| Mixed Contacts | NO |
| Option | GENERAL PURPOSE |
| Pitch | 0.031 0.80mm |
| Total Number of Contacts | 20 |
| Number of Conductors | ONE |
| Contact Finish | Gold |
| Reliability | COMMERCIAL |
| Body Length or Diameter | 0.677 inch |
| Number Of PCB Rows | 2 |
| Body Depth | 0.314 inch |
| Contact Resistance | 15mOhm |
| Card Type | Non Specified - Dual Edge |
| Read Out | Dual |
| Number of Positions/Bay/Row | 10 |
| Body/Shell Style | SOCKET |
| Contact Finish Thickness | 10.0μin 0.25μm |
| Card Thickness | 0.062 1.57mm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
HSEC8-110-01-L-DV-A-WT Overview
Packaged according to Tray's specs.It's recommended you mount it type Surface Mount.As a method of connecting, the device uses the connector socket CARD EDGE CONNECTOR.Currently, the device offers Board Guide, Solder Retention features.Device series Edge Rate? HSEC8 is indicated by the Edge Rate? HSEC8.Additionally, this chip has the following features: EDGE RATE CONTACT
HSEC8-110-01-L-DV-A-WT Features
Edge Rate? HSEC8 series
HSEC8-110-01-L-DV-A-WT Applications
There are a lot of Samtec Inc. HSEC8-110-01-L-DV-A-WT Edgeboard Connectors applications.
- Music recording
- Imaging Systems
- Battery Operated Systems
- Communication Systems
- AC motor control
- Audio/Video devices
- Industrial Process Control
- Communications
- TD-SCDMA, WiMAX
- Wireless local loop
