HSEC8-110-01-S-DV-A-BL
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Material | Beryllium Copper |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Material - Insulation | Liquid Crystal Polymer (LCP) |
| Operating Temperature | -55°C~125°C |
| Packaging | Tray |
| Published | 2013 |
| Series | Edge Rate™ HSEC8 |
| JESD-609 Code | e3 |
| Feature | Board Guide, Board Lock |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| Connector Type | CARD EDGE CONNECTOR |
| Number of Positions | 20 |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Subcategory | Headers and Edge Type Connectors |
| MIL Conformance | NO |
| DIN Conformance | NO |
| IEC Conformance | NO |
| Filter Feature | NO |
| Contact Type | Cantilever |
| Mixed Contacts | NO |
| Option | GENERAL PURPOSE |
| Pitch | 0.031 0.80mm |
| Total Number of Contacts | 20 |
| Number of Conductors | ONE |
| Contact Finish | Gold |
| Reliability | COMMERCIAL |
| Body Length or Diameter | 0.939 inch |
| Number Of PCB Rows | 2 |
| Body Depth | 0.314 inch |
| Contact Resistance | 15mOhm |
| Card Type | Non Specified - Dual Edge |
| Read Out | Dual |
| Number of Positions/Bay/Row | 10 |
| Contact Finish Thickness | 30.0μin 0.76μm |
| Plating Thickness | 30μin |
| Card Thickness | 0.062 1.57mm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
HSEC8-110-01-S-DV-A-BL Overview
The material was packaged according to the specifications of Tray.The mount type Surface Mount is recommended.A connector socket CARD EDGE CONNECTOR is used to connect the device.Board Guide, Board Lock features are present on the device.In the Edge Rate? HSEC8 field, the series of the device is indicated.
HSEC8-110-01-S-DV-A-BL Features
Edge Rate? HSEC8 series
HSEC8-110-01-S-DV-A-BL Applications
There are a lot of Samtec Inc. HSEC8-110-01-S-DV-A-BL Edgeboard Connectors applications.
- Digital Multimeters, PLC's (Programming Logic Controllers)
- Handheld Terminal Interface
- Micro and pico cell systems, software radios
- Cell Phones
- Displaying
- TD-SCDMA, WiMAX
- Digital signal processing
- Industrial Process Control
- Music reproduction technology
- Audio/Video devices
