Parameters |
Factory Lead Time |
1 Week |
Contact Material |
Beryllium Copper |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Housing Material |
Plastic |
Material - Insulation |
Liquid Crystal Polymer (LCP) |
Operating Temperature |
-55°C~125°C |
Packaging |
Tube |
Published |
2008 |
Series |
Edge Rate™ HSEC8 |
JESD-609 Code |
e3 |
Feature |
Board Guide |
Pbfree Code |
yes |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Termination |
Solder |
Connector Type |
CARD EDGE CONNECTOR |
Number of Positions |
20 |
Color |
Black |
Number of Rows |
2 |
Gender |
Female |
Subcategory |
Headers and Edge Type Connectors |
MIL Conformance |
NO |
DIN Conformance |
NO |
IEC Conformance |
NO |
Filter Feature |
NO |
Contact Type |
Cantilever |
Mixed Contacts |
NO |
Option |
GENERAL PURPOSE |
Pitch |
0.031 0.80mm |
Total Number of Contacts |
20 |
Current Rating |
3.1A |
Number of Conductors |
ONE |
Contact Finish |
Gold |
Reliability |
COMMERCIAL |
Body Length or Diameter |
0.496 inch |
Number Of PCB Rows |
2 |
Body Depth |
0.314 inch |
Contact Resistance |
15mOhm |
Card Type |
Non Specified - Dual Edge |
Read Out |
Dual |
Number of Positions/Bay/Row |
10 |
Row Spacing |
1.75 mm |
Contact Finish Thickness |
30.0μin 0.76μm |
Plating Thickness |
30μin |
Card Thickness |
0.062 1.57mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
HSEC8-110-01-SM-DV-A Overview
Materials were packaged in accordance with Tube's specifications.There is a recommendation for mounting type Surface Mount.Using the connector socket CARD EDGE CONNECTOR is the device's method of connection.Board Guide features are available on the device.Edge Rate? HSEC8 indicates that the device belongs to the series.
HSEC8-110-01-SM-DV-A Features
Edge Rate? HSEC8 series
HSEC8-110-01-SM-DV-A Applications
There are a lot of Samtec Inc. HSEC8-110-01-SM-DV-A Edgeboard Connectors applications.
- Scientific instruments.
- Broadband data applications
- Digital Storage Oscilloscope
- In-building wireless telephony
- Wireless local loop
- Digital beam-forming systems for ultrasound
- Communications
- Displaying
- 3-phase power control
- CMOS Image sensors for mobile applications