HSEC8-120-01-S-PV-4-2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Material | Beryllium Copper |
| Mounting Type | Surface Mount, Through Hole |
| Material - Insulation | Liquid Crystal Polymer (LCP) |
| Operating Temperature | -55°C~125°C |
| Packaging | Tray |
| Series | Edge Rate™ HSEC8 |
| JESD-609 Code | e3 |
| Feature | Board Guide |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| ECCN Code | EAR99 |
| Connector Type | CARD EDGE CONNECTOR |
| Number of Positions | 44 (40 + 4 Power) |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| HTS Code | 8536.69.40.40 |
| Subcategory | Headers and Edge Type Connectors |
| Contact Type | Cantilever |
| Pitch | 0.031 0.80mm |
| Total Number of Contacts | 44 |
| Number of Conductors | ONE |
| Contact Finish | Gold |
| Reliability | COMMERCIAL |
| Body Length or Diameter | 1.736 inch |
| Body Breadth | 0.315 inch |
| Body Depth | 0.599 inch |
| Contact Resistance | 15mOhm |
| Card Type | Non Specified - Dual Edge |
| Read Out | Dual |
| Insulation Resistance | 1000000000Ohm |
| Number of Positions/Bay/Row | 20; 2; 2 |
| Durability | 1000 Cycles |
| Mating Contact Row Spacing | 0.069 inch |
| Contact Finish Thickness | 30.0μin 0.76μm |
| Card Thickness | 0.093 2.36mm |
| RoHS Status | ROHS3 Compliant |
HSEC8-120-01-S-PV-4-2 Overview
Packaging was conducted in accordance with Tray's specifications.You should mount it with type Surface Mount, Through Hole.Connection to the device is made through the connector socket CARD EDGE CONNECTOR.Features of the device are Board Guide.The Edge Rate? HSEC8 indicates the series number of the device.
HSEC8-120-01-S-PV-4-2 Features
Edge Rate? HSEC8 series
HSEC8-120-01-S-PV-4-2 Applications
There are a lot of Samtec Inc. HSEC8-120-01-S-PV-4-2 Edgeboard Connectors applications.
- Telecommunications
- Battery Operated Systems
- Digital signal processing
- Handheld Terminal Interface
- Instrumentation and test equipment
- Medical Instrumentation and medical imaging
- Digital beam-forming systems for ultrasound
- In-building wireless telephony
- Audio/Video devices
- AC motor control
