HSEC8-130-01-S-DV-A-K-TR
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Material | Beryllium Copper |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Housing Material | Polymer |
| Material - Insulation | Liquid Crystal Polymer (LCP) |
| Operating Temperature | -55°C~125°C |
| Packaging | Tape & Reel (TR) |
| Published | 2013 |
| Series | Edge Rate™ HSEC8 |
| JESD-609 Code | e3 |
| Feature | Board Guide, Locking Ramp |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| ECCN Code | EAR99 |
| Connector Type | CARD EDGE CONNECTOR |
| Number of Positions | 60 |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| HTS Code | 8536.69.40.40 |
| Subcategory | Headers and Edge Type Connectors |
| Contact Type | Cantilever |
| Pitch | 0.031 0.80mm |
| Total Number of Contacts | 60 |
| Orientation | Straight |
| Number of Conductors | ONE |
| Reference Standard | UL, CSA |
| Contact Finish | Gold |
| Reliability | COMMERCIAL |
| Number Of PCB Rows | 2 |
| PCB Contact Pattern | RECTANGULAR |
| Body Depth | 0.314 inch |
| Rated Current (Signal) | 1.9A |
| Card Type | Non Specified - Dual Edge |
| Read Out | Dual |
| Number of Positions/Bay/Row | 30 |
| Body/Shell Style | PLUG |
| PCB Contact Row Spacing | 3.4036 mm |
| Contact Finish Thickness | 30.0μin 0.76μm |
| Card Thickness | 0.062 1.57mm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
HSEC8-130-01-S-DV-A-K-TR Overview
The material was packaged according to the specifications of Tape & Reel (TR).The mount type Surface Mount is recommended.Connecting the device uses connector socket CARD EDGE CONNECTOR.In addition to the device's features, it has Board Guide, Locking Ramp.Edge Rate? HSEC8 indicates the device series.
HSEC8-130-01-S-DV-A-K-TR Features
Edge Rate? HSEC8 series
HSEC8-130-01-S-DV-A-K-TR Applications
There are a lot of Samtec Inc. HSEC8-130-01-S-DV-A-K-TR Edgeboard Connectors applications.
- Medical Imaging
- Spectrum Analysis
- Microcontrollers.
- Data Acquisition Systems
- Multiplexed Data Acquisition Systems
- Telecommunications
- Wireless local loop
- Digital beam-forming systems for ultrasound
- High Speed Data Acquisition for PCs
- TD-SCDMA, WiMAX
