Parameters |
IEC Conformance |
NO |
Filter Feature |
NO |
Contact Type |
Cantilever |
Mixed Contacts |
NO |
Option |
GENERAL PURPOSE |
Pitch |
0.031 0.80mm |
Total Number of Contacts |
60 |
Orientation |
Straight |
Current Rating |
3.1A |
Number of Conductors |
ONE |
Contact Finish |
Gold |
Reliability |
COMMERCIAL |
Number Of PCB Rows |
2 |
Body Depth |
0.314 inch |
Contact Resistance |
15mOhm |
Card Type |
Non Specified - Dual Edge |
Read Out |
Dual |
Insulation Resistance |
1000000000Ohm |
Number of Positions/Bay/Row |
30 |
Row Spacing |
1.75 mm |
Max Current Rating |
3.1A |
Durability |
1000 Cycles |
Height |
7.8mm |
Length |
28.6mm |
Width |
7mm |
Contact Finish Thickness |
30.0μin 0.76μm |
Card Thickness |
0.062 1.57mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
Factory Lead Time |
1 Week |
Contact Material |
Beryllium Copper |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Housing Material |
Plastic |
Material - Insulation |
Liquid Crystal Polymer (LCP) |
Operating Temperature |
-55°C~125°C |
Packaging |
Tray |
Published |
2008 |
Series |
Edge Rate™ HSEC8 |
JESD-609 Code |
e3 |
Feature |
Board Guide |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Termination |
Solder |
Connector Type |
CARD EDGE CONNECTOR |
Number of Positions |
60 |
Color |
Black |
Number of Rows |
2 |
Gender |
Female |
Subcategory |
Headers and Edge Type Connectors |
MIL Conformance |
NO |
DIN Conformance |
NO |
HSEC8-130-01-SM-DV-A Overview
Tray wanted the material packaged as per his specs.There is a recommendation for mounting type Surface Mount.The device is connected by using the connector socket CARD EDGE CONNECTOR.In addition to the device's features, it has Board Guide.In this case, the Edge Rate? HSEC8 indicates the series of the device.
HSEC8-130-01-SM-DV-A Features
Edge Rate? HSEC8 series
HSEC8-130-01-SM-DV-A Applications
There are a lot of Samtec Inc. HSEC8-130-01-SM-DV-A Edgeboard Connectors applications.
- Communications
- Cell Phones
- Micro and pico cell systems, software radios
- High Speed Data Acquisition for PCs
- High Speed Data Acquisition
- Broadband data applications
- RADAR processing, digital oscilloscopes
- Multiplexed Data Acquisition Systems
- Digital beam-forming systems for ultrasound
- Imaging Systems