Parameters |
Factory Lead Time |
1 Week |
Contact Material |
Beryllium Copper |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Housing Material |
Polymer |
Material - Insulation |
Liquid Crystal Polymer (LCP) |
Operating Temperature |
-55°C~125°C |
Packaging |
Tray |
Published |
2012 |
Series |
Edge Rate™ HSEC8 |
JESD-609 Code |
e3 |
Feature |
Board Guide |
Pbfree Code |
yes |
Part Status |
Active |
Termination |
Solder |
Connector Type |
CARD EDGE CONNECTOR |
Number of Positions |
80 |
Color |
Black |
Number of Rows |
2 |
Gender |
Female |
Additional Feature |
EDGE RATE; FINAL INCH |
Subcategory |
Headers and Edge Type Connectors |
MIL Conformance |
NO |
DIN Conformance |
NO |
IEC Conformance |
NO |
Filter Feature |
NO |
Contact Type |
Cantilever |
Mixed Contacts |
NO |
Option |
GENERAL PURPOSE |
Pitch |
0.031 0.80mm |
Total Number of Contacts |
80 |
Orientation |
Straight |
Depth |
7.8mm |
Current Rating |
3.1A |
Number of Conductors |
ONE |
Contact Finish |
Gold |
Reliability |
COMMERCIAL |
Number Of PCB Rows |
2 |
Contact Resistance |
15mOhm |
Card Type |
Non Specified - Dual Edge |
Read Out |
Dual |
Insulation Resistance |
1000000000Ohm |
Number of Positions/Bay/Row |
40 |
Body/Shell Style |
SOCKET |
Durability |
1000 Cycles |
Length |
39.8mm |
Width |
5.6mm |
Contact Finish Thickness |
30.0μin 0.76μm |
Plating Thickness |
10μin |
Card Thickness |
0.062 1.57mm |
Radiation Hardening |
No |
RoHS Status |
ROHS3 Compliant |
HSEC8-140-01-L-DV-A Overview
It was packaged based on Tray's specs.It's recommended to mount type Surface Mount.Connecting the device to the connector socket CARD EDGE CONNECTOR is the method used by the device.Board Guide features are on this device.Edge Rate? HSEC8 indicates the device series.Please take note of the following additional features of this chip: EDGE RATE; FINAL INCH
HSEC8-140-01-L-DV-A Features
Edge Rate? HSEC8 series
HSEC8-140-01-L-DV-A Applications
There are a lot of Samtec Inc. HSEC8-140-01-L-DV-A Edgeboard Connectors applications.
- Microcontrollers.
- Instrumentation and test equipment
- Wireless and wired broadband communications
- Medical Instrumentation and medical imaging
- Cell Phones
- Imaging Systems
- Smart antenna systems
- Communication test equipment
- Digital beam-forming systems for ultrasound
- Multiplexed Data Acquisition Systems