Parameters |
Factory Lead Time |
1 Week |
Contact Material |
Beryllium Copper |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Material - Insulation |
Liquid Crystal Polymer (LCP) |
Operating Temperature |
-55°C~125°C |
Packaging |
Tray |
Published |
2013 |
Series |
Edge Rate™ HSEC8 |
JESD-609 Code |
e3 |
Feature |
Board Guide, Board Lock |
Part Status |
Active |
Termination |
Solder |
ECCN Code |
EAR99 |
Connector Type |
CARD EDGE CONNECTOR |
Number of Positions |
120 |
Color |
Black |
Number of Rows |
2 |
Gender |
Female |
Additional Feature |
EDGE RATE CONTACT |
HTS Code |
8536.69.40.40 |
Subcategory |
Headers and Edge Type Connectors |
MIL Conformance |
NO |
DIN Conformance |
NO |
IEC Conformance |
NO |
Filter Feature |
NO |
Contact Type |
Cantilever |
Mixed Contacts |
NO |
Option |
GENERAL PURPOSE |
Pitch |
0.031 0.80mm |
Total Number of Contacts |
120 |
Number of Conductors |
ONE |
Contact Finish |
Gold |
Reliability |
COMMERCIAL |
Number Of PCB Rows |
2 |
Body Depth |
0.314 inch |
Contact Resistance |
15mOhm |
Card Type |
Non Specified - Dual Edge |
Read Out |
Dual |
Insulation Resistance |
1000000000Ohm |
Number of Positions/Bay/Row |
60 |
Body/Shell Style |
SOCKET |
Durability |
1000 Cycles |
Contact Finish Thickness |
10.0μin 0.25μm |
Plating Thickness |
10μin |
Card Thickness |
0.062 1.57mm |
Radiation Hardening |
No |
RoHS Status |
ROHS3 Compliant |
HSEC8-160-01-L-DV-A-BL Overview
Packaging was done per Tray's specs.The mounting type Surface Mount is recommended.Connecting the device is accomplished through the connector socket CARD EDGE CONNECTOR.This device has Board Guide, Board Lock features.Device series is indicated by Edge Rate? HSEC8.Several additional features of this chip should be noted: EDGE RATE CONTACT
HSEC8-160-01-L-DV-A-BL Features
Edge Rate? HSEC8 series
HSEC8-160-01-L-DV-A-BL Applications
There are a lot of Samtec Inc. HSEC8-160-01-L-DV-A-BL Edgeboard Connectors applications.
- Multiplexed Data Acquisition Systems
- 4-channel data acquisition
- Uninterrupted Power Supplies
- Handheld Terminal Interface
- Wireless local loop
- Digital beam-forming systems for ultrasound
- Spectrum Analysis
- Broadband data applications
- CMOS Image sensors for mobile applications
- Microcontrollers.