HSEC8-180-01-L-DV-A
| Parameters | |
|---|---|
| Material - Insulation | Liquid Crystal Polymer (LCP) |
| Operating Temperature | -55°C~125°C |
| Packaging | Tray |
| Published | 2013 |
| Series | Edge Rate™ HSEC8 |
| JESD-609 Code | e3 |
| Feature | Board Guide |
| Pbfree Code | yes |
| Part Status | Active |
| Termination | Solder |
| Connector Type | CARD EDGE CONNECTOR |
| Number of Positions | 160 |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Subcategory | Headers and Edge Type Connectors |
| Contact Type | Cantilever |
| Pitch | 0.031 0.80mm |
| Total Number of Contacts | 160 |
| Number of Conductors | ONE |
| Contact Finish | Gold |
| Reliability | COMMERCIAL |
| Number Of PCB Rows | 2 |
| Body Depth | 0.314 inch |
| Contact Resistance | 15mOhm |
| Card Type | Non Specified - Dual Edge |
| Read Out | Dual |
| Insulation Resistance | 1000000000Ohm |
| Number of Positions/Bay/Row | 80 |
| Durability | 1000 Cycles |
| Contact Finish Thickness | 10.0μin 0.25μm |
| Plating Thickness | 10μin |
| Card Thickness | 0.062 1.57mm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
| Factory Lead Time | 1 Week |
| Contact Material | Beryllium Copper |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
HSEC8-180-01-L-DV-A Overview
Material was packaged according to Tray's specifications.It is recommended to mount the device using type Surface Mount.As a method of connecting, the device uses the connector socket CARD EDGE CONNECTOR.This device has Board Guide features.A Edge Rate? HSEC8 means the device is a series device.
HSEC8-180-01-L-DV-A Features
Edge Rate? HSEC8 series
HSEC8-180-01-L-DV-A Applications
There are a lot of Samtec Inc. HSEC8-180-01-L-DV-A Edgeboard Connectors applications.
- Cell Phones
- Digital beam-forming systems for ultrasound
- In-building wireless telephony
- Audio/Video devices
- Scientific instruments
- Digital Multimeters, PLC's (Programming Logic Controllers)
- Telecommunications
- Industrial Process Control
- 4-channel data acquisition
- Multiplexed Data Acquisition Systems
