Parameters | |
---|---|
Max Breakdown Voltage | 6V |
Height | 500μm |
Length | 800μm |
Width | 1.05mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |
Lifecycle Status | ACTIVE (Last Updated: 6 months ago) |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 4-XFDFN Exposed Pad |
Number of Pins | 4 |
Diode Element Material | SILICON |
Operating Temperature | -40°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Series | HSP |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 4 |
Termination | SMD/SMT |
ECCN Code | EAR99 |
Type | Steering (Rail to Rail) |
Applications | Ethernet, HDMI |
Additional Feature | ULTRA LOW CAPACITANCE |
Capacitance | 850FF |
Technology | AVALANCHE |
Depth | 1mm |
Base Part Number | HSP061 |
Number of Elements | 1 |
Working Voltage | 3V |
Polarity | Bidirectional |
Number of Channels | 2 |
Leakage Current | 100nA |
Element Configuration | Dual |
Power Line Protection | Yes |
Max Reverse Leakage Current | 100nA |
Clamping Voltage | 18V |
Peak Pulse Current | 30A |
Reverse Standoff Voltage | 3V |
Direction | Unidirectional |
Breakdown Voltage | 6V |
Rep Pk Reverse Voltage-Max | 15V |
Capacitance @ Frequency | 0.6pF @ 200MHz~3GHz |