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HTSW-103-09-G-S-RE

SAMTEC HTSW-103-09-G-S-RE Board-To-Board Connector, Right Angle, HTSW Series, 3 Contacts, Header, 2.54 mm, Through Hole


  • Manufacturer: Samtec Inc.
  • Nocochips NO: 680-HTSW-103-09-G-S-RE
  • Package: -
  • Datasheet: PDF
  • Stock: 965
  • Description: SAMTEC HTSW-103-09-G-S-RE Board-To-Board Connector, Right Angle, HTSW Series, 3 Contacts, Header, 2.54 mm, Through Hole (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Contact Material Phosphor Bronze
Mount Through Hole
Mounting Type Through Hole, Right Angle
Contact Shape Square
Insulation Material Liquid Crystal Polymer (LCP)
Operating Temperature -55°C~125°C
Packaging Bulk
Published 2005
Series HTSW
JESD-609 Code e4
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Termination Solder
Connector Type Header
Number of Positions 3
Number of Rows 1
Gender Male
Fastening Type Push-Pull
Contact Finish - Mating Gold
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Contact Type Male Pin
Mixed Contacts NO
Option GENERAL PURPOSE
Current Rating (Amps) Varies by WireGAuge
Insulation Height 0.122 3.10mm
Style Board to Board or Cable
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Natural
Number of Conductors ONE
Reliability COMMERCIAL
Contact Length - Post 0.190 4.83mm
Shrouding Unshrouded
Number Of PCB Rows 1
Lead Pitch 2.54mm
Contact Length - Mating 0.230 5.84mm
PCB Contact Pattern RECTANGULAR
Body Depth 0.26 inch
Contact Finish Thickness - Mating 10.0μin 0.25μm
Contact Finish Thickness - Post 3.00μin 0.076μm
Material Flammability Rating UL94 V-0
Radiation Hardening No
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
See Relate Datesheet

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