HTSW-108-08-G-Q-RA
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Material | Phosphor Bronze |
| Mount | Through Hole |
| Mounting Type | Through Hole, Right Angle |
| Contact Shape | Square |
| Insulation Material | Liquid Crystal Polymer (LCP) |
| Operating Temperature | -55°C~125°C |
| Packaging | Bulk |
| Published | 2005 |
| Series | HTSW |
| JESD-609 Code | e4 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Termination | Solder |
| Connector Type | Header |
| Number of Positions | 24 |
| Number of Rows | 3 |
| Gender | Male |
| Fastening Type | Push-Pull |
| Contact Finish - Mating | Gold |
| MIL Conformance | NO |
| DIN Conformance | NO |
| IEC Conformance | NO |
| Filter Feature | NO |
| Contact Type | Male Pin |
| Mixed Contacts | NO |
| Option | GENERAL PURPOSE |
| Current Rating (Amps) | Varies by WireGAuge |
| Insulation Height | 0.320 8.13mm |
| Style | Board to Board or Cable |
| Number of Positions Loaded | 16 |
| Pitch - Mating | 0.100 2.54mm |
| Insulation Color | Natural |
| Number of Conductors | ONE |
| Reliability | COMMERCIAL |
| Body Length or Diameter | 0.8 inch |
| Row Spacing - Mating | 0.100 (2.54mm) |
| Contact Length - Post | 0.090 2.29mm |
| Shrouding | Unshrouded |
| Number Of PCB Rows | 2 |
| Lead Pitch | 2.54mm |
| Contact Length - Mating | 0.230 5.84mm |
| PCB Contact Pattern | RECTANGULAR |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mating Contact Pitch | 0.1 inch |
| PCB Contact Row Spacing | 5.08 mm |
| Contact Finish Thickness - Mating | 10.0μin 0.25μm |
| Contact Finish Thickness - Post | 3.00μin 0.076μm |
| Material Flammability Rating | UL94 V-0 |
| REACH SVHC | No SVHC |
| RoHS Status | ROHS3 Compliant |
See Relate Datesheet
