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HTSW-114-25-G-D-LA

SAMTEC HTSW-114-25-G-D-LA Board-To-Board Connector, Right Angle, HTSW Series, 28 Contacts, Header, 2.54 mm, Through Hole


  • Manufacturer: Samtec Inc.
  • Nocochips NO: 680-HTSW-114-25-G-D-LA
  • Package: -
  • Datasheet: PDF
  • Stock: 496
  • Description: SAMTEC HTSW-114-25-G-D-LA Board-To-Board Connector, Right Angle, HTSW Series, 28 Contacts, Header, 2.54 mm, Through Hole (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Contact Material Phosphor Bronze
Mount Through Hole
Mounting Type Through Hole, Right Angle
Contact Shape Square
Insulation Material Liquid Crystal Polymer (LCP)
Operating Temperature -55°C~125°C
Packaging Bulk
Published 2005
Series HTSW
JESD-609 Code e4
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Termination Kinked Pin, Solder
Connector Type Header
Number of Positions 28
Number of Rows 2
Gender Male
Fastening Type Push-Pull
Contact Finish - Mating Gold
Contact Type Male Pin
Current Rating (Amps) Varies by WireGAuge
Insulation Height 0.240 6.10mm
Style Board to Board or Cable
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Natural
Number of Conductors ONE
Reliability COMMERCIAL
Body Length or Diameter 1.4 inch
Row Spacing - Mating 0.100 (2.54mm)
Contact Length - Post 0.100 2.54mm
Shrouding Unshrouded
Number Of PCB Rows 2
Lead Pitch 2.54mm
Contact Length - Mating 0.320 8.13mm
PCB Contact Pattern RECTANGULAR
Mating Contact Pitch 0.1 inch
Contact Finish Thickness - Mating 10.0μin 0.25μm
Contact Finish Thickness - Post 3.00μin 0.076μm
Material Flammability Rating UL94 V-0
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
See Relate Datesheet

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