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ICA-318-SGG

CONN IC DIP SOCKET 18POS GOLD


  • Manufacturer: Samtec Inc.
  • Nocochips NO: 680-ICA-318-SGG
  • Package: -
  • Datasheet: -
  • Stock: 322
  • Description: CONN IC DIP SOCKET 18POS GOLD (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Mount Through Hole
Mounting Type Through Hole
Housing Material Polyester, Glass Filled
Number of Positions or Pins (Grid) 18 (2 x 9)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass
Operating Temperature -55°C~125°C
Packaging Bulk
Published 2011
Series ICA
JESD-609 Code e4
Feature Open Frame
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type DIP, 0.3 (7.62mm) Row Spacing
Number of Rows 2
Additional Feature STANDARD: UL 94V-0
HTS Code 8536.69.40.40
Contact Finish - Mating Gold
Orientation Straight
Current Rating 1A
Pitch - Mating 0.100 2.54mm
Body Length or Diameter 0.9 inch
Number of Contacts 18
PCB Contact Pattern RECTANGULAR
Body Breadth 0.395 inch
Lead Length 3.175mm
Body Depth 0.1 inch
Contact Style MACHINE SCREW
Contact Resistance 10mOhm
Insulation Resistance 5000000000Ohm
Mating Contact Pitch 0.1 inch
Dielectric Withstanding Voltage 1400VAC V
PCB Contact Row Spacing 0.3 mm
Termination Post Length 0.125 3.18mm
Pitch - Post 0.100 2.54mm
Contact Finish Thickness - Mating 30.0μin 0.76μm
Contact Finish Thickness - Post 30.0μin 0.76μm
Material Flammability Rating UL94 V-0
Radiation Hardening No
RoHS Status ROHS3 Compliant
Flammability Rating UL94 V-0
See Relate Datesheet

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