Parameters | |
---|---|
Packaging | Bulk |
Published | 2011 |
Series | ICO |
JESD-609 Code | e3 |
Feature | Open Frame |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | Solder |
ECCN Code | EAR99 |
Type | DIP, 0.3 (7.62mm) Row Spacing |
Number of Rows | 2 |
Additional Feature | LOW PROFILE |
Contact Finish - Mating | Gold |
Orientation | Straight |
Depth | 10.03mm |
Current Rating | 1A |
Pitch - Mating | 0.100 2.54mm |
Number of Contacts | 8 |
Contact Finish - Post | Tin |
PCB Contact Pattern | RECTANGULAR |
Body Breadth | 0.395 inch |
Lead Length | 3.175mm |
Contact Style | MACHINE SCREW |
Contact Resistance | 10mOhm |
Insulation Resistance | 5GOhm |
Row Spacing | 7.62 mm |
Mating Contact Pitch | 0.1 inch |
Max Current Rating | 1A |
Dielectric Withstanding Voltage | 1400VAC V |
Termination Post Length | 0.125 3.18mm |
Pitch - Post | 0.100 2.54mm |
Length | 10.16mm |
Contact Finish Thickness - Mating | 30.0μin 0.76μm |
Material Flammability Rating | UL94 V-0 |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |
Flammability Rating | UL94 V-0 |
Factory Lead Time | 1 Week |
Contact Material | Copper |
Mount | Through Hole |
Mounting Type | Through Hole |
Insulation Material | Polyester |
Housing Material | Polyester, Glass Filled |
Number of Positions or Pins (Grid) | 8 (2 x 4) |
Contact Material - Mating | Beryllium Copper |
Contact Material - Post | Brass |
Operating Temperature | -55°C~125°C |