Parameters |
Mounting Type |
Surface Mount |
Package / Case |
208-BGA |
Operating Temperature |
0°C~70°C |
Packaging |
Tray |
Series |
72T |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Voltage - Supply |
2.375V~2.625V |
Base Part Number |
72T20118 |
Function |
Synchronous |
Current - Supply (Max) |
60mA |
Memory Size |
2.5M 128K x 20 256K x 10 |
Access Time |
3.2ns |
Data Rate |
250MHz |
Bus Directional |
Uni-Directional |
FWFT Support |
Yes |
Expansion Type |
Depth, Width |
RoHS Status |
Non-RoHS Compliant |
IDT72T20118L4BB Overview
The 208-BGA package contains FIFO memory chip.In terms of packaging, it comes in Tray cases.Apps and data can be stored in the 2.5M 128K x 20 256K x 10 memory of the FIFO chip.It is recommended that the temperature of the system be regulated to 0°C~70°C for reliable operation.Mounting type Surface Mount indicates that the FIFO memory is mounted.It uses a supply voltage of 2.375V~2.625V to operate.It is a component from the 72T series.It has a maximum operating supply current of 60mA .Memory IC is a member of the 72T20118 family.
IDT72T20118L4BB Features
2.5M 128K x 20 256K x 10 memory size
72T series
Best part number of 72T20118
IDT72T20118L4BB Applications
There are a lot of Renesas Electronics America Inc. IDT72T20118L4BB FIFOs Memory applications.
- Signal processing
- General Data Collection Applications at Low-Temperatures
- Wireless
- Smart Meter
- Tape controllers
- Extended product life cycle
- Game Controller
- Controlled baseline
- Alarm System
- Industrial Systems