Parameters |
Mounting Type |
Surface Mount |
Package / Case |
208-BGA |
Supplier Device Package |
208-PBGA (17x17) |
Operating Temperature |
0°C~70°C |
Packaging |
Tray |
Series |
72T |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Voltage - Supply |
2.375V~2.625V |
Base Part Number |
72T20118 |
Function |
Synchronous |
Current - Supply (Max) |
60mA |
Memory Size |
2.5M 128K x 20 256K x 10 |
Access Time |
3.6ns |
Data Rate |
200MHz |
Bus Directional |
Uni-Directional |
Retransmit Capability |
Yes |
FWFT Support |
Yes |
Programmable Flags Support |
Yes |
Expansion Type |
Depth, Width |
RoHS Status |
Non-RoHS Compliant |
IDT72T20118L5BB Overview
This package is included in 208-BGA .This FIFO memory chip is packaged as a Tray .There is a memory of 2.5M 128K x 20 256K x 10 on the FIFO chip that can be used to store applications and data.To ensure reliable operation, the temperature should be regulated to 0°C~70°C .A mounting type of Surface Mount is associated with the FIFO memory.It uses a supply voltage of 2.375V~2.625V to operate.This memory logic is part of the 72T series.60mA is the FIFO's maximum operating supply current.The 72T20118 family of objects contains it.
IDT72T20118L5BB Features
2.5M 128K x 20 256K x 10 memory size
72T series
Best part number of 72T20118
IDT72T20118L5BB Applications
There are a lot of Renesas Electronics America Inc. IDT72T20118L5BB FIFOs Memory applications.
- Transistors
- Data-acquisition systems
- Queues for communication systems
- High-speed disk
- Computer networks
- Emulators
- A/D output buffers
- Computers
- Wireless
- Signal processing