Parameters |
Supplier Device Package |
208-PBGA (17x17) |
Operating Temperature |
0°C~70°C |
Packaging |
Tray |
Series |
72T |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Voltage - Supply |
2.375V~2.625V |
Base Part Number |
72T40108 |
Function |
Synchronous |
Current - Supply (Max) |
60mA |
Memory Size |
2.5M 64K x 40 |
Access Time |
3.8ns |
Data Rate |
150MHz |
Bus Directional |
Uni-Directional |
Retransmit Capability |
Yes |
FWFT Support |
Yes |
Programmable Flags Support |
Yes |
Expansion Type |
Depth, Width |
RoHS Status |
Non-RoHS Compliant |
Mounting Type |
Surface Mount |
Package / Case |
208-BGA |
IDT72T40108L6-7BB Overview
You will find FIFO memory chip in the 208-BGA package.It's packaged in the shape of a Tray .A FIFO chip's memory is 2.5M 64K x 40 , which may be used to store applications and data.It is recommended that the temperature be kept at 0°C~70°C to ensure reliable operation.A mounting type of Surface Mount is associated with the FIFO memory.A supply voltage of 2.375V~2.625V is required for its operation.The 72T series includes this memory logic.This FIFO products can operate at a maximum operating supply current of 60mA .Memory IC belongs to the family of 72T40108 .
IDT72T40108L6-7BB Features
2.5M 64K x 40 memory size
72T series
Best part number of 72T40108
IDT72T40108L6-7BB Applications
There are a lot of Renesas Electronics America Inc. IDT72T40108L6-7BB FIFOs Memory applications.
- Computer networks
- Medical Monitoring Device
- MP3 Interface for Automobile
- Laser Receiver System
- Consumer Systems
- SPD for DDR3 Memory Modules
- High-speed graphics pixel buffer
- Seismic Data Collection at Extreme Temperatures
- High-speed disk
- Alarm System