IDT72T40118L4BBG
| Parameters | |
|---|---|
| Mount | Surface Mount |
| Package / Case | BGA |
| Published | 2009 |
| JESD-609 Code | e1 |
| Moisture Sensitivity Level (MSL) | 3 |
| Number of Terminations | 208 |
| ECCN Code | EAR99 |
| Terminal Finish | TIN SILVER COPPER |
| Max Operating Temperature | 70°C |
| Min Operating Temperature | 0°C |
| Additional Feature | ALTERNATIVE MEMORY WIDTH: 10 AND 20 |
| HTS Code | 8542.32.00.71 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Number of Functions | 1 |
| Supply Voltage | 2.5V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Pin Count | 208 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 2.625V |
| Temperature Grade | COMMERCIAL |
| Supply Voltage-Min (Vsup) | 2.375V |
| Operating Mode | SYNCHRONOUS |
| Access Time | 4 ns |
| Organization | 128KX40 |
| Memory Width | 40 |
| Memory Density | 5242880 bit |
| Parallel/Serial | PARALLEL |
| Output Enable | YES |
| Height Seated (Max) | 1.97mm |
| Length | 17mm |
| Width | 17mm |
| RoHS Status | RoHS Compliant |
IDT72T40118L4BBG Overview
BGA is a package that contains FIFO memory chip.Mounting it Surface Mount is recommended.When the supply voltage is 2.5V , high efficiency is possible.FIFO consists of 208 terminations, which indicates that FIFO means is empty.This FIFO products runs at 0°C degrees Celsius at a minimum temperature to ensure reliability.70°C °C is the memory logic's maximum operating temperature that allows stable operation.This FIFO memory IC is equipped with 208 pins in total.With the help of this FIFO memory, ALTERNATIVE MEMORY WIDTH: 10 AND 20 can also be generated.Voltage FIFO memory IC's maximum is set to 2.625V .The supply voltage (Vsup) should remain above 2.375V to ensure normal operation.
IDT72T40118L4BBG Features
IDT72T40118L4BBG Applications
There are a lot of Integrated Device Technology (IDT) IDT72T40118L4BBG FIFOs Memory applications.
- General Data Collection Applications at Low-Temperatures
- Code converters
- One assembly
- Consumer
- Multi-stage synchronizer
- Temporary storage elements
- Communications Systems
- Game Consoles
- Routers
- Cardiac Monitoring Device
