IDT72V3682L10PFG
| Parameters | |
|---|---|
| Mount | Surface Mount |
| Package / Case | LQFP |
| Published | 2009 |
| JESD-609 Code | e3 |
| Moisture Sensitivity Level (MSL) | 3 |
| Number of Terminations | 120 |
| ECCN Code | EAR99 |
| Terminal Finish | Matte Tin (Sn) - annealed |
| Max Operating Temperature | 70°C |
| Min Operating Temperature | 0°C |
| Additional Feature | MAIL BOX BYPASS REGISTER |
| HTS Code | 8542.32.00.71 |
| Technology | CMOS |
| Terminal Position | QUAD |
| Terminal Form | GULL WING |
| Peak Reflow Temperature (Cel) | 260 |
| Number of Functions | 1 |
| Supply Voltage | 3.3V |
| Terminal Pitch | 0.4mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Pin Count | 120 |
| JESD-30 Code | S-PQFP-G120 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 3.45V |
| Temperature Grade | COMMERCIAL |
| Supply Voltage-Min (Vsup) | 3.15V |
| Operating Mode | SYNCHRONOUS |
| Access Time | 10 ns |
| Organization | 16KX36 |
| Memory Width | 36 |
| Memory Density | 589824 bit |
| Parallel/Serial | PARALLEL |
| Output Enable | YES |
| Height Seated (Max) | 1.6mm |
| Length | 14mm |
| Width | 14mm |
| RoHS Status | RoHS Compliant |
IDT72V3682L10PFG Overview
LQFP is a package that contains FIFO memory chip.Mounting it in the Surface Mount way is recommended.When the supply voltage is 3.3V , high efficiency is possible.As a result of this, FIFO means contains 120 terminations.This FIFO products runs at 0°C degrees Celsius at a minimum temperature to ensure reliability.70°C °C is the memory logic's maximum operating temperature that allows stable operation.It has a total of 120 pins on it.Additionally, this FIFO memory can be used to generate MAIL BOX BYPASS REGISTER .The FIFO memory IC's maximum supply voltage is set to 3.45V .To ensure normal operation, the supply voltage should be greater than 3.15V (Vsup).
IDT72V3682L10PFG Features
IDT72V3682L10PFG Applications
There are a lot of Integrated Device Technology (IDT) IDT72V3682L10PFG FIFOs Memory applications.
- Computer Systems
- Optical memories
- Video Processing
- Multimedia
- Transistors
- Telecommunication
- Queues for communication systems
- Thermal Management for DDR3 Memory Modules
- Digital buffering
- Wireless
