IDT74SSTUBH32868ABKG
| Parameters | |
|---|---|
| Mount | Surface Mount |
| Package / Case | TFBGA |
| Published | 2006 |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Moisture Sensitivity Level (MSL) | 3 |
| Number of Terminations | 176 |
| Terminal Finish | TIN SILVER COPPER |
| Max Operating Temperature | 70°C |
| Min Operating Temperature | 0°C |
| HTS Code | 8542.39.00.01 |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Number of Functions | 1 |
| Supply Voltage | 1.8V |
| Terminal Pitch | 0.65mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Pin Count | 176 |
| JESD-30 Code | R-PBGA-B176 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1.9V |
| Temperature Grade | COMMERCIAL |
| Supply Voltage-Min (Vsup) | 1.7V |
| Number of Bits | 28 |
| Family | SSTU |
| Logic Function | Buffer |
| Output Polarity | TRUE |
| Logic IC Type | D FLIP-FLOP |
| Trigger Type | POSITIVE EDGE |
| Propagation Delay (tpd) | 1.5 ns |
| fmax-Min | 410 MHz |
| Length | 15mm |
| Width | 6mm |
| RoHS Status | RoHS Compliant |
See Relate Datesheet
