Parameters | |
---|---|
Mount | Surface Mount |
Package / Case | TFBGA |
Packaging | Tape & Reel (TR) |
Published | 2006 |
JESD-609 Code | e1 |
Pbfree Code | yes |
Moisture Sensitivity Level (MSL) | 3 |
Number of Terminations | 176 |
Terminal Finish | TIN SILVER COPPER |
Max Operating Temperature | 70°C |
Min Operating Temperature | 0°C |
HTS Code | 8542.39.00.01 |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 260 |
Number of Functions | 1 |
Supply Voltage | 1.8V |
Terminal Pitch | 0.65mm |
Time@Peak Reflow Temperature-Max (s) | 30 |
Pin Count | 176 |
JESD-30 Code | R-PBGA-B176 |
Qualification Status | Not Qualified |
Operating Supply Voltage | 1.9V |
Temperature Grade | COMMERCIAL |
Supply Voltage-Min (Vsup) | 1.7V |
Number of Bits | 28 |
Family | SSTU |
Logic Function | Buffer |
Output Polarity | TRUE |
Logic IC Type | D FLIP-FLOP |
Trigger Type | POSITIVE EDGE |
Propagation Delay (tpd) | 1.5 ns |
fmax-Min | 410 MHz |
Length | 15mm |
Width | 6mm |
RoHS Status | RoHS Compliant |