IDTSTAC9204X5NBEB2XR
| Parameters | |
|---|---|
| Mount | Surface Mount |
| Package / Case | QFN |
| Packaging | Tape & Reel (TR) |
| Published | 2012 |
| Max Operating Temperature | 70°C |
| Min Operating Temperature | 0°C |
| Resolution | 3 B |
| RoHS Status | RoHS Compliant |
IDTSTAC9204X5NBEB2XR Overview
Space-saving is achieved by supplying it in the QFN package. This package uses the Tape & Reel (TR) packaging method. On a PCB based on Surface Mount technology, it is mounted. It is set with a maximum value of 70°C to maintain normal operation. To maintain normal use, the operating temperature is set to 0°C.
IDTSTAC9204X5NBEB2XR Features
Embedded in the QFN package
IDTSTAC9204X5NBEB2XR Applications
There are a lot of Integrated Device Technology (IDT) IDTSTAC9204X5NBEB2XR CODECs Interface ICs applications.
- Data distribution
- War field flying robot with a using night-vision flying camera
- Code conversion
- Image denoising
- Conveying
- Automatic health monitoring systems
- Microprocessor
- Flight simulators
- Electronic circuits
- Automated Guided Vehicles (AGV)
