IDTSTAC9205X3TAEB2XR
| Parameters | |
|---|---|
| Mount | Surface Mount |
| Package / Case | LQFP |
| Packaging | Tape & Reel (TR) |
| Published | 2012 |
| Max Operating Temperature | 70°C |
| Min Operating Temperature | 0°C |
| Resolution | 3 B |
| RoHS Status | RoHS Compliant |
IDTSTAC9205X3TAEB2XR Overview
In order to save space, it is packaged in the LQFP package. Tape & Reel (TR) is the packaging method used. This device is mounted on a PCB which uses the Surface Mount technology. It is set to the maximum value of 70°C so normal use can be maintained. Temperatures above 0°C are set as the minimum to prevent malfunctions.
IDTSTAC9205X3TAEB2XR Features
Embedded in the LQFP package
IDTSTAC9205X3TAEB2XR Applications
There are a lot of Integrated Device Technology (IDT) IDTSTAC9205X3TAEB2XR CODECs Interface ICs applications.
- Packaging
- Speed synchronization of multiple motors in industries
- Dimensionality reduction
- Microprocessor
- Electronics industry
- Food & beverage
- Multiplication
- Stagecraft
- Conveying
- Demultiplexing
