Parameters | |
---|---|
Power Dissipation-Max | 195.3W Tc |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 195.3W |
Case Connection | DRAIN |
Turn On Delay Time | 12.4 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 150m Ω @ 9.3A, 10V |
Vgs(th) (Max) @ Id | 4.5V @ 900μA |
Halogen Free | Halogen Free |
Input Capacitance (Ciss) (Max) @ Vds | 2340pF @ 100V |
Current - Continuous Drain (Id) @ 25°C | 22.4A Tc |
Gate Charge (Qg) (Max) @ Vgs | 86nC @ 10V |
Rise Time | 7.6ns |
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 5.6 ns |
Turn-Off Delay Time | 52.8 ns |
Continuous Drain Current (ID) | 22.4A |
Gate to Source Voltage (Vgs) | 20V |
Max Dual Supply Voltage | 650V |
Drain to Source Breakdown Voltage | 650V |
Pulsed Drain Current-Max (IDM) | 72A |
Max Junction Temperature (Tj) | 150°C |
Height | 4.7mm |
RoHS Status | ROHS3 Compliant |
Lead Free | Contains Lead |
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | TO-263-3, D2Pak (2 Leads + Tab), TO-263AB |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Cut Tape (CT) |
Published | 2008 |
Series | CoolMOS™ |
JESD-609 Code | e3 |
Pbfree Code | no |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
Terminal Finish | Tin (Sn) |
Technology | MOSFET (Metal Oxide) |
Terminal Position | SINGLE |
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Reach Compliance Code | not_compliant |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Pin Count | 4 |
JESD-30 Code | R-PSSO-G2 |
Number of Elements | 1 |
Configuration | SINGLE WITH BUILT-IN DIODE |
Number of Channels | 1 |