Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Package / Case | TO-263-3 |
Surface Mount | YES |
Number of Pins | 3 |
Packaging | Tape & Reel (TR) |
Published | 2008 |
JESD-609 Code | e3 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Max Operating Temperature | 175°C |
Min Operating Temperature | -55°C |
Max Power Dissipation | 300W |
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Reach Compliance Code | not_compliant |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Reference Standard | AEC-Q101 |
JESD-30 Code | R-PSSO-G2 |
Number of Elements | 1 |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 300W |
Case Connection | DRAIN |
Turn On Delay Time | 23 ns |
Halogen Free | Halogen Free |
Rise Time | 63ns |
Drain to Source Voltage (Vdss) | 40V |
Polarity/Channel Type | N-CHANNEL |
Fall Time (Typ) | 22 ns |
Turn-Off Delay Time | 46 ns |
Continuous Drain Current (ID) | 80A |
Gate to Source Voltage (Vgs) | 20V |
Max Dual Supply Voltage | 40V |
Drain to Source Breakdown Voltage | 40V |
Input Capacitance | 4.4nF |
Avalanche Energy Rating (Eas) | 660 mJ |
FET Technology | METAL-OXIDE SEMICONDUCTOR |
Rds On Max | 3.7 mΩ |
RoHS Status | ROHS3 Compliant |