IRF1010EPBF
| Parameters | |
|---|---|
| Mount | Through Hole |
| Input Capacitance (Ciss) (Max) @ Vds | 3210pF @ 25V |
| Mounting Type | Through Hole |
| Current - Continuous Drain (Id) @ 25°C | 84A Tc |
| Gate Charge (Qg) (Max) @ Vgs | 130nC @ 10V |
| Package / Case | TO-220-3 |
| Rise Time | 78ns |
| Number of Pins | 3 |
| Drive Voltage (Max Rds On,Min Rds On) | 10V |
| Transistor Element Material | SILICON |
| Vgs (Max) | ±20V |
| Operating Temperature | -55°C~175°C TJ |
| Fall Time (Typ) | 53 ns |
| Packaging | Tube |
| Turn-Off Delay Time | 48 ns |
| Continuous Drain Current (ID) | 84A |
| Published | 2001 |
| Threshold Voltage | 4V |
| JEDEC-95 Code | TO-220AB |
| Gate to Source Voltage (Vgs) | 20V |
| Drain Current-Max (Abs) (ID) | 75A |
| Series | HEXFET® |
| Drain to Source Breakdown Voltage | 60V |
| Part Status | Active |
| Dual Supply Voltage | 60V |
| Nominal Vgs | 4 V |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Height | 16.51mm |
| Number of Terminations | 3 |
| Length | 10.668mm |
| Width | 4.826mm |
| Radiation Hardening | No |
| REACH SVHC | No SVHC |
| Termination | Through Hole |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
| ECCN Code | EAR99 |
| Resistance | 12mOhm |
| Additional Feature | AVALANCHE RATED, HIGH RELIABILITY, ULTRA LOW RESISTANCE |
| Subcategory | FET General Purpose Power |
| Voltage - Rated DC | 60V |
| Technology | MOSFET (Metal Oxide) |
| Current Rating | 84A |
| Lead Pitch | 2.54mm |
| Number of Elements | 1 |
| Power Dissipation-Max | 200W Tc |
| Element Configuration | Single |
| Operating Mode | ENHANCEMENT MODE |
| Power Dissipation | 170W |
| Case Connection | DRAIN |
| Turn On Delay Time | 12 ns |
| FET Type | N-Channel |
| Transistor Application | SWITCHING |
| Factory Lead Time | 1 Week |
| Rds On (Max) @ Id, Vgs | 12m Ω @ 50A, 10V |
| Contact Plating | Tin |
| Vgs(th) (Max) @ Id | 4V @ 250μA |
See Relate Datesheet
