Parameters | |
---|---|
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 180W |
Case Connection | DRAIN |
Turn On Delay Time | 13 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 11m Ω @ 43A, 10V |
Factory Lead Time | 1 Week |
Vgs(th) (Max) @ Id | 4V @ 250μA |
Contact Plating | Tin |
Input Capacitance (Ciss) (Max) @ Vds | 3210pF @ 25V |
Mount | Through Hole |
Current - Continuous Drain (Id) @ 25°C | 85A Tc |
Mounting Type | Through Hole |
Package / Case | TO-220-3 |
Gate Charge (Qg) (Max) @ Vgs | 120nC @ 10V |
Number of Pins | 3 |
Transistor Element Material | SILICON |
Rise Time | 76ns |
Operating Temperature | -55°C~175°C TJ |
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 48 ns |
Turn-Off Delay Time | 39 ns |
Packaging | Tube |
Continuous Drain Current (ID) | 85A |
Published | 2001 |
Series | HEXFET® |
JESD-609 Code | e3 |
Threshold Voltage | 4V |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
JEDEC-95 Code | TO-220AB |
Number of Terminations | 3 |
Termination | Through Hole |
Gate to Source Voltage (Vgs) | 20V |
ECCN Code | EAR99 |
Drain to Source Breakdown Voltage | 55V |
Resistance | 11MOhm |
Pulsed Drain Current-Max (IDM) | 290A |
Additional Feature | AVALANCHE RATED, ULTRA LOW RESISTANCE |
Dual Supply Voltage | 55V |
Avalanche Energy Rating (Eas) | 250 mJ |
Subcategory | FET General Purpose Power |
Recovery Time | 100 ns |
Max Junction Temperature (Tj) | 175°C |
Voltage - Rated DC | 55V |
Nominal Vgs | 4 V |
Technology | MOSFET (Metal Oxide) |
Height | 19.8mm |
Current Rating | 85A |
Length | 10.6426mm |
Width | 4.82mm |
Lead Pitch | 2.54mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
Number of Elements | 1 |
RoHS Status | ROHS3 Compliant |
Number of Channels | 1 |
Lead Free | Contains Lead, Lead Free |
Power Dissipation-Max | 180W Tc |
Element Configuration | Single |