Parameters | |
---|---|
Power Dissipation-Max | 110W Tc |
Element Configuration | Single |
Power Dissipation | 110W |
Turn On Delay Time | 14 ns |
FET Type | P-Channel |
Factory Lead Time | 1 Week |
Rds On (Max) @ Id, Vgs | 60mOhm @ 16A, 10V |
Contact Plating | Tin |
Vgs(th) (Max) @ Id | 4V @ 250μA |
Mount | Through Hole |
Input Capacitance (Ciss) (Max) @ Vds | 1200pF @ 25V |
Mounting Type | Through Hole |
Current - Continuous Drain (Id) @ 25°C | 31A Tc |
Package / Case | TO-220-3 |
Gate Charge (Qg) (Max) @ Vgs | 63nC @ 10V |
Number of Pins | 3 |
Rise Time | 66ns |
Supplier Device Package | TO-220AB |
Drain to Source Voltage (Vdss) | 55V |
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Operating Temperature | -55°C~175°C TJ |
Vgs (Max) | ±20V |
Packaging | Tube |
Fall Time (Typ) | 63 ns |
Turn-Off Delay Time | 39 ns |
Published | 2000 |
Continuous Drain Current (ID) | -31A |
Threshold Voltage | -4V |
Series | HEXFET® |
Gate to Source Voltage (Vgs) | 20V |
Drain to Source Breakdown Voltage | -55V |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Dual Supply Voltage | -55V |
Input Capacitance | 1.2nF |
Termination | Through Hole |
Recovery Time | 110 ns |
Max Junction Temperature (Tj) | 175°C |
Resistance | 60mOhm |
Drain to Source Resistance | 60mOhm |
Max Operating Temperature | 175°C |
Rds On Max | 60 mΩ |
Nominal Vgs | -4 V |
Height | 19.3mm |
Min Operating Temperature | -55°C |
Length | 10.5156mm |
Width | 4.69mm |
Radiation Hardening | No |
Voltage - Rated DC | -55V |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Technology | MOSFET (Metal Oxide) |
Lead Free | Contains Lead, Lead Free |
Current Rating | -31A |
Lead Pitch | 2.54mm |
Number of Elements | 1 |
Number of Channels | 1 |