Parameters | |
---|---|
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
ECCN Code | EAR99 |
Voltage - Rated DC | 30V |
Technology | MOSFET (Metal Oxide) |
Terminal Position | BOTTOM |
Peak Reflow Temperature (Cel) | 260 |
Current Rating | 32A |
Time@Peak Reflow Temperature-Max (s) | 40 |
JESD-30 Code | R-XBCC-N3 |
Number of Elements | 1 |
Configuration | SINGLE WITH BUILT-IN DIODE |
Power Dissipation-Max | 3.9W Ta 89W Tc |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 89W |
Case Connection | DRAIN |
Turn On Delay Time | 18 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 2.6m Ω @ 27A, 10V |
Vgs(th) (Max) @ Id | 2.25V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 4860pF @ 15V |
Current - Continuous Drain (Id) @ 25°C | 32A Ta 150A Tc |
Gate Charge (Qg) (Max) @ Vgs | 56nC @ 4.5V |
Rise Time | 57ns |
Drive Voltage (Max Rds On,Min Rds On) | 4.5V 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 6.5 ns |
Turn-Off Delay Time | 24 ns |
Continuous Drain Current (ID) | 22A |
Gate to Source Voltage (Vgs) | 20V |
Drain-source On Resistance-Max | 0.0026Ohm |
Drain to Source Breakdown Voltage | 30V |
Pulsed Drain Current-Max (IDM) | 220A |
Avalanche Energy Rating (Eas) | 310 mJ |
Height | 506μm |
Length | 6.35mm |
Width | 5.05mm |
Radiation Hardening | No |
RoHS Status | RoHS Compliant |
Lead Free | Lead Free |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | DirectFET™ Isometric MX |
Number of Pins | 5 |
Transistor Element Material | SILICON |
Operating Temperature | -40°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2006 |
Series | HEXFET® |