Parameters | |
---|---|
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | DirectFET™ Isometric MT |
Number of Pins | 5 |
Supplier Device Package | DIRECTFET™ MT |
Operating Temperature | -40°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2006 |
Series | HEXFET® |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | SMD/SMT |
Resistance | 3.4MOhm |
Max Operating Temperature | 150°C |
Min Operating Temperature | -40°C |
Voltage - Rated DC | 40V |
Technology | MOSFET (Metal Oxide) |
Current Rating | 23A |
Number of Elements | 1 |
Power Dissipation-Max | 2.8W Ta 89W Tc |
Power Dissipation | 89W |
Turn On Delay Time | 18 ns |
FET Type | N-Channel |
Rds On (Max) @ Id, Vgs | 3.4mOhm @ 23A, 10V |
Vgs(th) (Max) @ Id | 2.25V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 5950pF @ 15V |
Current - Continuous Drain (Id) @ 25°C | 23A Ta 150A Tc |
Gate Charge (Qg) (Max) @ Vgs | 63nC @ 4.5V |
Rise Time | 47ns |
Drain to Source Voltage (Vdss) | 40V |
Drive Voltage (Max Rds On,Min Rds On) | 4.5V 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 4.9 ns |
Turn-Off Delay Time | 27 ns |
Continuous Drain Current (ID) | 18A |
Threshold Voltage | 1.35V |
Gate to Source Voltage (Vgs) | 20V |
Drain to Source Breakdown Voltage | 40V |
Dual Supply Voltage | 40V |
Input Capacitance | 5.95nF |
Recovery Time | 57 ns |
Drain to Source Resistance | 4.1mOhm |
Rds On Max | 3.4 mΩ |
Nominal Vgs | 1.35 V |
Height | 506μm |
Length | 6.35mm |
Width | 5.05mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | RoHS Compliant |
Lead Free | Lead Free |