Parameters | |
---|---|
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | DirectFET™ Isometric MX |
Number of Pins | 5 |
Supplier Device Package | DIRECTFET™ MX |
Operating Temperature | -40°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2006 |
Series | HEXFET® |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | SMD/SMT |
Resistance | 2.1MOhm |
Max Operating Temperature | 150°C |
Min Operating Temperature | -40°C |
Voltage - Rated DC | 25V |
Technology | MOSFET (Metal Oxide) |
Current Rating | 29A |
Power Dissipation-Max | 2.8W Ta 100W Tc |
Power Dissipation | 100W |
Turn On Delay Time | 20 ns |
FET Type | N-Channel |
Rds On (Max) @ Id, Vgs | 2.1mOhm @ 29A, 10V |
Vgs(th) (Max) @ Id | 2.35V @ 100μA |
Input Capacitance (Ciss) (Max) @ Vds | 4260pF @ 13V |
Current - Continuous Drain (Id) @ 25°C | 29A Ta 180A Tc |
Gate Charge (Qg) (Max) @ Vgs | 51nC @ 4.5V |
Rise Time | 67ns |
Drain to Source Voltage (Vdss) | 25V |
Drive Voltage (Max Rds On,Min Rds On) | 4.5V 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 7.4 ns |
Turn-Off Delay Time | 20 ns |
Continuous Drain Current (ID) | 23A |
Threshold Voltage | 1.8V |
Gate to Source Voltage (Vgs) | 20V |
Drain to Source Breakdown Voltage | 25V |
Dual Supply Voltage | 25V |
Input Capacitance | 4.26nF |
Drain to Source Resistance | 2.7mOhm |
Rds On Max | 2.1 mΩ |
Nominal Vgs | 1.8 V |
Height | 506μm |
Width | 5.05mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | RoHS Compliant |
Lead Free | Lead Free |