Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | DirectFET™ Isometric MZ |
Number of Pins | 5 |
Transistor Element Material | SILICON |
Operating Temperature | -40°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2007 |
Series | HEXFET® |
JESD-609 Code | e1 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
ECCN Code | EAR99 |
Resistance | 51mOhm |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Subcategory | FET General Purpose Power |
Voltage - Rated DC | 200V |
Technology | MOSFET (Metal Oxide) |
Terminal Position | BOTTOM |
Current Rating | 4.6A |
JESD-30 Code | R-XBCC-N3 |
Number of Elements | 1 |
Configuration | SINGLE WITH BUILT-IN DIODE |
Power Dissipation-Max | 2.8W Ta 89W Tc |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 89W |
Case Connection | DRAIN |
Turn On Delay Time | 16 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 59.9m Ω @ 5.5A, 10V |
Vgs(th) (Max) @ Id | 4.9V @ 150μA |
Input Capacitance (Ciss) (Max) @ Vds | 2290pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 4.6A Ta 26A Tc |
Gate Charge (Qg) (Max) @ Vgs | 48nC @ 10V |
Rise Time | 11ns |
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 6.5 ns |
Turn-Off Delay Time | 31 ns |
Continuous Drain Current (ID) | 3.7A |
Gate to Source Voltage (Vgs) | 20V |
Drain Current-Max (Abs) (ID) | 26A |
Drain to Source Breakdown Voltage | 200V |
Pulsed Drain Current-Max (IDM) | 37A |
Avalanche Energy Rating (Eas) | 46 mJ |
Height | 506μm |
Length | 6.35mm |
Width | 5.05mm |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |