Parameters | |
---|---|
Current Rating | 10.3A |
JESD-30 Code | R-XBCC-N3 |
Number of Elements | 1 |
Power Dissipation-Max | 2.8W Ta 89W Tc |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 2.8W |
Case Connection | DRAIN |
Turn On Delay Time | 17 ns |
FET Type | N-Channel |
Rds On (Max) @ Id, Vgs | 13m Ω @ 10.3A, 10V |
Vgs(th) (Max) @ Id | 4.8V @ 150μA |
Input Capacitance (Ciss) (Max) @ Vds | 2210pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 10.3A Ta 60A Tc |
Gate Charge (Qg) (Max) @ Vgs | 47nC @ 10V |
Rise Time | 26ns |
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 16 ns |
Turn-Off Delay Time | 34 ns |
Continuous Drain Current (ID) | 8.3A |
Threshold Voltage | 2.8V |
Gate to Source Voltage (Vgs) | 20V |
Drain to Source Breakdown Voltage | 100V |
Pulsed Drain Current-Max (IDM) | 228A |
Dual Supply Voltage | 100V |
Avalanche Energy Rating (Eas) | 86 mJ |
Recovery Time | 63 ns |
Nominal Vgs | 2.8 V |
Height | 506μm |
Length | 6.35mm |
Width | 5.05mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | RoHS Compliant |
Mount | Surface Mount |
Lead Free | Lead Free |
Mounting Type | Surface Mount |
Package / Case | DirectFET™ Isometric MN |
Number of Pins | 5 |
Transistor Element Material | SILICON |
Operating Temperature | -40°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2005 |
Series | HEXFET® |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
Termination | SMD/SMT |
Resistance | 13MOhm |
Additional Feature | LOW CONDUCTION LOSS |
Voltage - Rated DC | 100V |
Technology | MOSFET (Metal Oxide) |
Terminal Position | BOTTOM |