Parameters | |
---|---|
Contact Plating | Copper, Silver, Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | DirectFET™ Isometric SJ |
Number of Pins | 5 |
Supplier Device Package | DIRECTFET™ SJ |
Operating Temperature | -40°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2005 |
Series | HEXFET® |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | SMD/SMT |
Resistance | 35MOhm |
Max Operating Temperature | 150°C |
Min Operating Temperature | -40°C |
Voltage - Rated DC | 100V |
Technology | MOSFET (Metal Oxide) |
Current Rating | 5.7A |
Number of Elements | 1 |
Power Dissipation-Max | 2.2W Ta 42W Tc |
Element Configuration | Single |
Power Dissipation | 42W |
Turn On Delay Time | 9.2 ns |
FET Type | N-Channel |
Rds On (Max) @ Id, Vgs | 35mOhm @ 5.7A, 10V |
Vgs(th) (Max) @ Id | 4.9V @ 50μA |
Input Capacitance (Ciss) (Max) @ Vds | 890pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 5.7A Ta 25A Tc |
Gate Charge (Qg) (Max) @ Vgs | 20nC @ 10V |
Rise Time | 5ns |
Drain to Source Voltage (Vdss) | 100V |
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 5.1 ns |
Turn-Off Delay Time | 18 ns |
Continuous Drain Current (ID) | 4.5A |
Threshold Voltage | 3V |
Gate to Source Voltage (Vgs) | 20V |
Drain to Source Breakdown Voltage | 100V |
Dual Supply Voltage | 100V |
Input Capacitance | 890pF |
Recovery Time | 47 ns |
Drain to Source Resistance | 28mOhm |
Rds On Max | 35 mΩ |
Nominal Vgs | 3 V |
Height | 530μm |
Length | 4.826mm |
Width | 3.95mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | RoHS Compliant |
Lead Free | Lead Free |