Parameters | |
---|---|
Case Connection | DRAIN |
Turn On Delay Time | 11 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 4.9m Ω @ 17A, 10V |
Vgs(th) (Max) @ Id | 2.4V @ 50μA |
Input Capacitance (Ciss) (Max) @ Vds | 1570pF @ 13V |
Current - Continuous Drain (Id) @ 25°C | 17A Ta 68A Tc |
Gate Charge (Qg) (Max) @ Vgs | 18nC @ 4.5V |
Rise Time | 40ns |
Drive Voltage (Max Rds On,Min Rds On) | 4.5V 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 12 ns |
Turn-Off Delay Time | 14 ns |
Continuous Drain Current (ID) | 17A |
Gate to Source Voltage (Vgs) | 20V |
Factory Lead Time | 1 Week |
Drain to Source Breakdown Voltage | 25V |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | DirectFET™ Isometric SQ |
Height | 506μm |
Number of Pins | 6 |
Transistor Element Material | SILICON |
Length | 4.826mm |
Operating Temperature | -40°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2009 |
Width | 3.95mm |
Series | HEXFET® |
JESD-609 Code | e1 |
Radiation Hardening | No |
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Lead Free | Lead Free |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Resistance | 4.9MOhm |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Subcategory | FET General Purpose Power |
Technology | MOSFET (Metal Oxide) |
Terminal Position | BOTTOM |
JESD-30 Code | R-XBCC-N2 |
Number of Elements | 1 |
Configuration | SINGLE WITH BUILT-IN DIODE |
Power Dissipation-Max | 2.2W Ta 36W Tc |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 36W |