Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Copper, Silver, Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | DirectFET™ Isometric SQ |
Number of Pins | 6 |
Transistor Element Material | SILICON |
Operating Temperature | -40°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2005 |
Series | HEXFET® |
JESD-609 Code | e1 |
Part Status | Last Time Buy |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Resistance | 3.7MOhm |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Subcategory | FET General Purpose Power |
Technology | MOSFET (Metal Oxide) |
Terminal Position | BOTTOM |
Terminal Form | NO LEAD |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | R-XBCC-N2 |
Qualification Status | Not Qualified |
Number of Elements | 1 |
Configuration | SINGLE WITH BUILT-IN DIODE |
Number of Channels | 1 |
Power Dissipation-Max | 2.1W Ta 32W Tc |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 2.1W |
Case Connection | DRAIN |
Turn On Delay Time | 8.7 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 3.7m Ω @ 19A, 10V |
Vgs(th) (Max) @ Id | 2.1V @ 35μA |
Input Capacitance (Ciss) (Max) @ Vds | 1590pF @ 13V |
Current - Continuous Drain (Id) @ 25°C | 19A Ta 74A Tc |
Gate Charge (Qg) (Max) @ Vgs | 17nC @ 4.5V |
Rise Time | 19ns |
Drive Voltage (Max Rds On,Min Rds On) | 4.5V 10V |
Vgs (Max) | ±16V |
Fall Time (Typ) | 5.5 ns |
Turn-Off Delay Time | 11 ns |
Continuous Drain Current (ID) | 19A |
Gate to Source Voltage (Vgs) | 16V |
Drain Current-Max (Abs) (ID) | 74A |
Drain to Source Breakdown Voltage | 25V |
Avalanche Energy Rating (Eas) | 32 mJ |
Max Junction Temperature (Tj) | 150°C |
Height | 700μm |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |