Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | DirectFET™ Isometric MX |
Number of Pins | 7 |
Transistor Element Material | SILICON |
Operating Temperature | -40°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2012 |
Series | HEXFET® |
Part Status | Last Time Buy |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
ECCN Code | EAR99 |
Subcategory | FET General Purpose Power |
Technology | MOSFET (Metal Oxide) |
Terminal Position | BOTTOM |
JESD-30 Code | R-XBCC-N3 |
Number of Elements | 1 |
Configuration | SINGLE WITH BUILT-IN DIODE |
Power Dissipation-Max | 2.1W Ta 78W Tc |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 78W |
Case Connection | DRAIN |
Turn On Delay Time | 18 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 1.1m Ω @ 35A, 10V |
Vgs(th) (Max) @ Id | 2.1V @ 100μA |
Input Capacitance (Ciss) (Max) @ Vds | 5435pF @ 13V |
Current - Continuous Drain (Id) @ 25°C | 35A Ta 213A Tc |
Gate Charge (Qg) (Max) @ Vgs | 62nC @ 4.5V |
Rise Time | 46ns |
Drive Voltage (Max Rds On,Min Rds On) | 4.5V 10V |
Vgs (Max) | ±16V |
Fall Time (Typ) | 19 ns |
Turn-Off Delay Time | 24 ns |
Continuous Drain Current (ID) | 35A |
Threshold Voltage | 1.6V |
Gate to Source Voltage (Vgs) | 16V |
Drain to Source Breakdown Voltage | 25V |
Pulsed Drain Current-Max (IDM) | 280A |
FET Feature | Schottky Diode (Body) |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |