Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 8-SOIC (0.154, 3.90mm Width) |
Number of Pins | 8 |
Transistor Element Material | SILICON |
Manufacturer Package Identifier | IRF7103TRPBF |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 1997 |
Series | HEXFET® |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 8 |
Termination | SMD/SMT |
ECCN Code | EAR99 |
Resistance | 130mOhm |
Additional Feature | LOGIC LEVEL COMPATIBLE |
Subcategory | FET General Purpose Power |
Voltage - Rated DC | 50V |
Max Power Dissipation | 2W |
Terminal Form | GULL WING |
Current Rating | 3A |
Base Part Number | IRF7103PBF |
Number of Elements | 2 |
Row Spacing | 6.3 mm |
Element Configuration | Dual |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 2W |
Turn On Delay Time | 5.1 ns |
FET Type | 2 N-Channel (Dual) |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 130m Ω @ 3A, 10V |
Vgs(th) (Max) @ Id | 3V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 290pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs | 30nC @ 10V |
Rise Time | 8ns |
Fall Time (Typ) | 25 ns |
Turn-Off Delay Time | 15 ns |
Continuous Drain Current (ID) | 3A |
Threshold Voltage | 3V |
Gate to Source Voltage (Vgs) | 20V |
Drain Current-Max (Abs) (ID) | 3A |
Drain to Source Breakdown Voltage | 50V |
Dual Supply Voltage | 50V |
FET Technology | METAL-OXIDE SEMICONDUCTOR |
Recovery Time | 100 ns |
FET Feature | Standard |
Nominal Vgs | 3 V |
Height | 1.4986mm |
Length | 4.9784mm |
Width | 3.9878mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Contains Lead, Lead Free |