Parameters | |
---|---|
Turn-Off Delay Time | 100 ns |
Packaging | Tape & Reel (TR) |
Continuous Drain Current (ID) | -5.3A |
Published | 1997 |
Threshold Voltage | -2.5V |
Series | HEXFET® |
Gate to Source Voltage (Vgs) | 12V |
Drain to Source Breakdown Voltage | -20V |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Dual Supply Voltage | -20V |
Recovery Time | 100 ns |
Number of Terminations | 8 |
Nominal Vgs | -2.5 V |
Resistance | 60mOhm |
Height | 1.4986mm |
Additional Feature | LOGIC LEVEL COMPATIBLE |
Length | 4.9784mm |
Width | 3.9878mm |
Voltage - Rated DC | -20V |
Radiation Hardening | No |
Technology | MOSFET (Metal Oxide) |
REACH SVHC | No SVHC |
Terminal Position | DUAL |
RoHS Status | ROHS3 Compliant |
Terminal Form | GULL WING |
Lead Free | Contains Lead, Lead Free |
Current Rating | -5.3A |
Number of Elements | 1 |
Power Dissipation-Max | 2.5W Tc |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 2.5W |
Output Current | 5.3A |
Turn On Delay Time | 14 ns |
FET Type | P-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 60m Ω @ 5.3A, 10V |
Vgs(th) (Max) @ Id | 2.5V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 860pF @ 10V |
Current - Continuous Drain (Id) @ 25°C | 5.3A Ta |
Factory Lead Time | 1 Week |
Gate Charge (Qg) (Max) @ Vgs | 25nC @ 10V |
Mount | Surface Mount |
Rise Time | 26ns |
Mounting Type | Surface Mount |
Package / Case | 8-SOIC (0.154, 3.90mm Width) |
Drain to Source Voltage (Vdss) | 20V |
Number of Pins | 8 |
Transistor Element Material | SILICON |
Drive Voltage (Max Rds On,Min Rds On) | 4.5V 10V |
Operating Temperature | -55°C~150°C TJ |
Vgs (Max) | ±12V |
Fall Time (Typ) | 68 ns |