Parameters | |
---|---|
FET Type | N-Channel |
Rds On (Max) @ Id, Vgs | 22m Ω @ 4A, 10V |
Vgs(th) (Max) @ Id | 1V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 1200pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 8.5A Ta |
Gate Charge (Qg) (Max) @ Vgs | 57nC @ 10V |
Rise Time | 37ns |
Drive Voltage (Max Rds On,Min Rds On) | 4.5V 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 40 ns |
Turn-Off Delay Time | 42 ns |
Continuous Drain Current (ID) | 8.5A |
Threshold Voltage | 1V |
Gate to Source Voltage (Vgs) | 20V |
Drain Current-Max (Abs) (ID) | 6.7A |
Drain to Source Breakdown Voltage | 30V |
Dual Supply Voltage | 30V |
Recovery Time | 78 ns |
Nominal Vgs | 1 V |
Height | 1.4986mm |
Length | 4.9784mm |
Width | 3.9878mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mount | Surface Mount, Through Hole |
Mounting Type | Surface Mount |
Package / Case | 8-SOIC (0.154, 3.90mm Width) |
Number of Pins | 8 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 1997 |
Series | HEXFET® |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 8 |
Resistance | 22mOhm |
Additional Feature | LOGIC LEVEL COMPATIBLE |
Voltage - Rated DC | 30V |
Technology | MOSFET (Metal Oxide) |
Terminal Position | DUAL |
Terminal Form | GULL WING |
Current Rating | 8.5A |
Number of Elements | 1 |
Row Spacing | 6.3 mm |
Power Dissipation-Max | 2.5W Ta |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 2.5W |
Turn On Delay Time | 10 ns |